Home
Active Projects
Resources
About Us
News
FAQ
|
|
ADC
Analog-to-digital converter
AGC
Automatic gain control
AMOS
Active micro-optical system
APCVD
Atmospheric pressure chemical vapour deposition
APW
Acoustic plate mode
ASE
Anisotropic Silicon Etch
ASIC
Application-specific integrated circuit
Accelerometer
A sensor used to measure acceleration
BBR
Breathing bar resonator
BCC
Body-centred cubic
BGA
Ball grid array
BHF
Buffered hydrofluoric acid
BJT
Bipolar junction transistor
BPSG
Borophosphosilicate glass
BSG
Borosilicate glass
BiCMOS
Bipolar complementary metal oxide semiconductor
C-V
Current voltage
CAD
Computer aided design
CB
Common base (configuration)
CC
Common collector (configuration)
CCD
Charge-coupled device
CCR
Corner cube reflector
CD
Critical dimension
CE
Common emitter (configuration)
CFD
Computational fluid dynamics
CILJ
Central interface unit
CMOS
Complementary Metal Oxide Semiconductor
CMP
Chemical mechanical polish
CNC
Computer numerically controlled
COM
Coupling of mode
COP
Poly(glycidyl methacrylate co-ethyl acrylate)
COTS
Commercial off the shelf
CP
Conducting polymer
CPL
Capillary pumped loop
CPU
Central processing unit
CRT
Cathode ray tube
CTE
Coefficient of temperature expansion
CVD
Chemical vapor deposition
DES
Diethyl silane
DI
Deionised water
DILP
Dual-in-line package
DLP
Digital Light projection
DM
Deformable mirror
DMD
Digital micromirror device
DMOS
Diffused-channel MOS (process)
DO
Dissolved oxygen
DOE
Design of experiments
DOF
Degrees of freedom
DPIV
Digital particle image velocimetry
DRAM
Dynamic random access memory
DRIE
Deep reactive ion etch
DSE
Doping selective etching
DSP
Digital signal processor
DUV
Deep ultravioloet (light)
Dielectric Charging
Charge of a dielectric (an insulator), including a charge trapped on the surface
ECL
Emitter coupled logic
EDP
Ethylene-diamine-pyrocatechol
EDS
Energy dispersive spectroscopy
EFAB
Electrochemical fabrication
EGS
Electronic grade silicon
EM
Electromagnetic (radiation)
EPD
electrophoretic deposition
EPROM
Electronically erasable programmable read-only memory
ESV
Electrostatic voltmeter
FCC
Face-centred cubic
FDTS
Fluorodecyltrichlorosilane
FED
Field emission device
FEM
Finite element model
FET
Field-effect transistor
FFT
Fast Fourier transform
FM
Frequency modulated
FPGA
Field programmable gate array
FPW
Flexural plate wave
FS
Full-scale operation
FSPIV
Forward scattering particle image velocimetry
FTE
Full time equivalent
GaAs
Gallium arsenide
HCP
Hexagonal close packed
HF
Hydrofluoric acid
HMDS
Hexamethyl disilazane
HTCC
High-temperature co-fired ceramic
IAB
industrial advisory board
IC
integrated circuit
ICP
inductively coupled plasma
IH
Integrated harden resin
INFOMD
Integrated near field microfluidic devices
IOP
Intraocular pressure
JFET
junction field effect transistor
KOH
Potassium hydroxide
LCD
Liquid crystal display
LED
light emitting diode
LOCOS
Local oxide isolation of silicon
LPCVD
Low pressure chemical vapor deposition
LPF
Low pass filter
LTCC
Low-temperature co-fired ceramic
LTO
low temperature oxide
MAV
Micro air vehicle
MBE
Molecular beam epitaxy
MCM
Multichip module
MCU
Main control unit
MEMS
Microelectromechanical system
MFC
Mass-flow controller
MGS
Metallurgical-grade silicon
MISFET
Metal-insulator semiconductor field-effect transistor
MOEMS
Microoptoelectromechanical system
MOS
Metal oxide semiconductor
MOSFET
Metal oxide semiconductor field-effect transistor
MS
Methyl silane
MSL
Microstereolithography
MST
Microsystems technology
MUMPS
Multi user MEMS process service
MW
Molecular weight
Magnetometer
A sensor used to measure the inensity of an electric field
Mass Spectrometer
An instrument for identifying atomic, molecular and their concentration in different mediums
Mips
Million instructions per second
NAM
National Association of Manufacturers
NFO
Near-field optical
NRE
Nonretuming engineering (costs)
NSOM
Near-field scanning optical microscope
OCP
Open-circuit potential
OMA
Ohio MEMS Association
OTS
Octadecyl trichlorosilane
PAA
Programmable analogue array
PARC
Pattern recognition
PCB
Printed circuit board
PDMS
Polydimethylsiloxane
PDS
Parylene deposition system
PE
Piezoelectric
PECVD
Plasma enhanced chemical vapor deposition
PGA
Programmable gate array ,-
PHET
Photovoltaic electrochemical etchstop technique
PIV
Particle image velocimetry
PLA
Programmable logic array
PLD
Programmable logic device
PLL
Phase locked loop
PMMA
Polymethylmethacrylate (acrylic)
POEMS
Polymer opto electro mechanical systems
PP
Passivating potential
PSG
Phosphosilicate glass
PSI
Pounds per square inch
PTAT
Proportional to absolute temperature
PTFE
Poly(tetrafluoroethylene)
PTO
Lead titanate
PVC
Poly(vinyl chloride)
PVD
Physical vapour deposition
PVDF
Polyvinylidene fluoride
PWB
Printed wiring board
PZT
Lead zirconate titanate
QCM
Quartz crystal microbalance
RC
Resistance capacitance
REDOX
Reduction oxidation (reaction)
RF
Radio frequency
RIB
Reactive ion beam (milling)
RIE
Reactive ion etching aka RIB
RMS
Root-mean-square
ROG
Resonant output gyroscope
RTA
Rapid thermal annealing
RXL
Resonant accelerometer
Relay
An electromechanical or semiconductor switch in which a current or voltage applied across one port controls currents or voltages across another
SALT
Steered agile laser transceivers
SAM
Self assembled monolayer
SC
Simple cubic
SCREAM
Single-crystal reactive etching and metallisation (process)
SEM
Scanning electron microscope
SFF
Solid freeform fabrication
SIM
Stress induced martensite
SIMOX
Separation by implanted oxygen
SL
Stereolithography
SMA
Shape memory alloy
SMT
Surface mount technology
SNOM
Scanning near field optical microscopy
SOE
Silicon on epoxy
SOI
Silicon on insulator
STEC
Staggered torsional electrostatic combdrive
Stiction
A phenomenon that appears when a very strong interfacial adhesion force (capillary, Van der Walls, or electrostatic) is created between smooth contacting surfaces.
TAB
Tape-automated bonding
TCO
Temperature coefficient of operation
TCR
Temperature coefficient of resistance
TEOS
Tetraethylorthosilicate Si(OC2H5)4
TFT
Thin film transistor
TMAH
Tetramethylammonum hydroxide
TMS
Tetramethyl silane
TOS
Tensile optical surface
UHMWPE
Ultra high molecular weight polyethylene
UV
Ultraviolet (light)
VLSI
Very large-scale integration
VP
Vapour pressure
VPE
Vapour-phase epitaxy
keV
Kilo electronvolt
nMOS
n-type metal oxide semiconductor
p-n
Junction diode made from /?-type and n-type materials
pMOS
P-type metal oxide semiconductor
ppm
Parts per million
|